Failure analysis (FA) engineers diagnose root causes of chip defects and yield loss. They utilize FIB (Focused Ion Beam), SEM (Scanning Electron Microscopy), and EDX spectroscopy to examine microscopic flaws. Knowledge of defect mapping, electrical characterization, and reliability standards (JEDEC) is essential. Companies such as Intel, TSMC, and STMicroelectronics recruit FA enginee... https://bestnanotech.in/candidate/